Intel 13-16 generation Core roadmap announced, through 5 generations of technology

2022-07-24 0 By

In the recent investor conference, Intel announced a large number of new processors, new process progress, the intensity is very fierce, before 2025 to mass production of 5 generations of advanced technology, launched 4 generations of core processors.The Alder Lake core 12 uses Intel 7 technology, and the Raptor Lake Core 13 will continue to use Intel 7 technology later this year. The Raptor Lake Core 13 will also use Intel 7 technology to increase productivity and improve performance. This time, the Core 13 will add eight more performance cores, a total of 24 cores and 32 threads.13 Generation Core Meteor Lake will be released in 2023 and upgraded to Intel 4 technology. It will be the first time to use a non-single chip design, flexibly integrate multiple small chip modules, including the next-generation hybrid architecture CPU, tGPU core display engine, AI acceleration unit, and very low power consumption.And Raja Koduri, executive in charge of the GPU business, says that the architecture of Meteor Lake’s processors is very exciting, providing unique levels of performance with significant energy efficiency.Due to this unique architecture, Raja Koduri says that the GPU on Meteor Lake is not even called collectivised/core anymore, and it’s not quite right to call it univised, so it looks like Intel needs to give this GPU a new name.The next 15 generations of Arrow Lake core will be released in 2024, first with Intel 20A technology (roughly known as 2nm level) and N3, also known as TSMC 3nm, for the first time.Support RibbonFET and PowerVia technologies, achieving approximately 15% improvement in performance per watt. Production will begin in the first half of 2024.However, the 16th generation of Lunar Lake will be released after 2024. It will continue to promote IDM 2.0 technology and integrate internal and external technology. The internal own technology will be upgraded to Intel 18A(roughly equivalent to 1.8nm level), and the external technology will not be disclosed.Intel’s goal is to inherit more than 1 trillion transistors in a single device by 2030 through various technologies such as advanced RibbonFET, high-Na EUV lithography, Foveros 3D packaging, etc.